Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
AssigneeApplied Materials, Inc.
InventorDusan Jevtic
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AssigneeApplied Materials, Inc.
InventorDusan Jevtic
Estimating the term…
Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool). The sequencer assigns priority values to the chambers in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the robot to move the wafers in a particular stage.
A method for scheduling semiconductor wafers for processing within a multiple chamber, semiconductor wafer processing system having a plurality of chambers, said method comprising:
Apparatus for scheduling semiconductor wafers for processing within a multiple chamber, semiconductor wafer processing system having a plurality of chambers, said apparatus comprising:
A data structure stored in a computer memory, where said data structure is used by a sequencer to define a trajectory of one or more wafers through a cluster tool, comprising at least one field defining a priority of a chamber within said cluster tool.
Dependencies are inferred from the claim text.