Apparatus for polishing peripheral portion of wafer

A polishing apparatus for polishing a peripheral portion of a semiconductor wafer, comprising:

• a rotary drum having a periphery around which a tape having an abrasive layer thereon is wound, and the rotary drum being rotated by a first motor;
• a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, a wafer inclining member for changing a tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with a main surface of the wafer, and a holding member moving mechanism for moving the wafer holding member on the supporting member so that a peripheral portion of the wafer and a portion of the tape to be brought into contact with the peripheral portion of the wafer are always on or near a predetermined line;
• and
• a moving member for bringing the wafer held on the supporting member into contact with, or separating the wafer from, the tape wound around the rotary drum.