Method for manufacturing completely circular semiconductor wafers
AssigneeNEC Corporation
InventorSatoru Muramatsu
Life of this patent
Estimating the term…
Abstract
In a method for manufacturing completely circular wafers, a specified crystal orientation of a cylindrical semiconductor crystal member is detected, and a support is mounted on the semiconductor crystal member in accordance with the detected specified crystal orientation. Then, a recognition mark is marked on a top face of the semiconductor crystal member in accordance with a position of the support. Then, the semiconductor crystal member and the support are cut to form a semiconductor wafer and a support piece. Finally, the semiconductor wafer is separated from the support piece.
Claims27
An apparatus for manufacturing a plurality of completely circular semiconductor wafers from a cylindrical semiconductor crystal member, comprising:
- a detecting device for detecting a specified crystal orientation of said cylindrical semiconductor crystal member;
- a mounting device for mounting a support on said cylindrical semiconductor member in accordance with the specified crystal orientation thereof;
- a marking and cutting device for marking a recognition mark on a top face of said cylindrical semiconductor crystal member in accordance with a position of said support and for cutting said cylindrical semiconductor crystal member marked with said recognition mark and said support to form a plurality of semiconductor wafers each attached to a separate support piece;
- and
- a separating device for separating each said semiconductor wafer from its respective support piece.
An apparatus for manufacturing a plurality of completely circular semiconductor wafers from a cylindrical semiconductor crystal member, comprising:
- a detecting device for detecting a specified crystal orientation of said cylindrical semiconductor crystal member;
- a mounting device for mounting a support on said cylindrical semiconductor member in accordance with the specified crystal orientation thereof;
- a cutting and marking device for cutting said cylindrical semiconductor crystal member marked with said recognition mark and said support to form a plurality of semiconductor wavers each attached to a separate support piece and for marking a recognition mark on a face of said cylindrical semiconductor wafer in accordance with a position of said support piece;
- and
- a separating device for separating said semiconductor wafer from its respective support piece.
An apparatus for manufacturing a plurality of completely circular semiconductor wafers from a cylindrical semiconductor crystal member, comprising:
- a detection device for detecting a specified crystal orientation of said cylindrical semiconductor crystal member;
- a mounting device for mounting a support on said cylindrical semiconductor member in accordance with the specified crystal orientation thereof;
- a cutter for cutting said cylindrical semiconductor crystal member marked with said recognition mark and said support to form a plurality of semiconductor wafers each attached to a separate support piece;
- a mark making unit for marking a recognition mark on a face of said cylindrical semiconductor wafer in accordance with a position of said support piece;
- and
- a separating device for separating said semiconductor wafer from its respective support piece.
An apparatus for manufacturing a plurality of completely circular semiconductor wafers from a cylindrical semiconductor crystal member, comprising:
- a detector for detecting a specified crystal orientation of said cylindrical semiconductor crystal member;
- a mounting device for mounting a support on said cylindrical semiconductor member in accordance with the specified crystal orientation thereof;
- a cutting and marking device for cutting said cylindrical semiconductor crystal member marked with said recognition mark and said support to form a semiconductor wafer attached to a support piece and for marking a recognition mark on a face of said cylindrical semiconductor wafer in accordance with a position of said support piece, said cutting and marking means comprising a laser marking unit;
- a cutter;
- and a transporting mechanism, interposed between said laser marking unit and said cutter, for transporting said semiconductor wafer and its respective support piece from said cutter to said laser marking unit.
Dependencies are inferred from the claim text.