Vertically integrated multi-chip circuit package with heat-sink support
AssigneeInternational Business Machines Corporation
InventorsAnthony P. Ingraham, Glenn L. Kehley, Sanjeev B. Sathe, John R. Slack
Life of this patent
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Abstract
A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.
Claims31
A circuitized chip carrier comprising:
- one layer of a flexible material having at least one wiring layer including wiring traces, said one layer of flexible material is formed as one continuous piece in both horizontal and vertical dimensions;
- a means for each said wiring layer to communicate through said flexible material;
- a heat sink adhered to said one layer of flexible material and holding said one layer of flexible material in a three dimensional (3D) form;
- a plurality of chip connection pads for mounting chips in any direction on said one layer of flexible material, said chip connection pads connected to said wiring layer on said layer of flexible material;
- and
- carrier attachment pads on said one layer of flexible material for providing signals and power.
A circuitized chip carrier comprising:
- a flexible material having a multiplicity of sublayers, at least one of said sublayers including wiring traces, said flexible material formed as one continuous piece in both horizontal and vertical directions;
- a means for each said wiring layer to communicate through said sublayer and between each of said multiplicity of sublayers of flexible material;
- a heat sink adhered to said at least one sublayer of flexible material and holding said at least one sublayer of flexible material in a three-dimensional (3D) form;
- a plurality of chip connection pads for mounting chips in any direction on said at least one sublayer of flexible material, said chip connection pads connected to said wiring layer on said sublayer of flexible material;
- and
- carrier attachment pads on said one sublayer of flexible material for providing signals and power.
A circuitized chip carrier comprising:
- a multiplicity of layers of a flexible material having at least one wiring layer including wiring traces, where in at least one layer of flexible material is formed as one continuous piece in both horizontal and vertical dimensions, and wherein each said layer of flexible material is stacked against another layer;
- a means for each said wiring layer to communicate through said flexible material and between each of said multiplicity of layers of flexible material;
- a heat sink adhered to said at least one wiring layer and holding said wiring layer of flexible material in a three dimensional (3D) form;
- a plurality of chip connection pads for mounting chips in any direction on said wiring layer of flexible material, said chip connection pads connected to said wiring layer on said layer of flexible material;
- and
- carrier attachment pads on said one layer of flexible material for providing signals and power.
A method of assembling an integrated circuit chip carrier comprising the steps of:
- attaching an electronic component to a first side of a flexible circuitized carrier;
- attaching a second electronic component to a second side of said flexible circuitized carrier;
- forming said flexible circuitized carrier into a three-dimensional shape in one continuous piece around at least two separate surfaces of a heat sink;
- attaching said formed flexible circuitized carrier to a substrate.
A method of assembling an integrated circuit chip carrier comprising the steps of:
- bonding a first flexible circuitized carrier to a second flexible circuitited carrier;
- attaching an electronic component to a first side of said bonded flexible circuitized carriers;
- attaching a second electronic component to a second side of said bonded flexible circuitized carriers;
- forming said bonded flexible circuitized carriers around a heat sink;
- attaching said formed carriers to a substrate.
Dependencies are inferred from the claim text.