Method for reworking a multi-layer circuit board using a shape memory alloy material

A method for reworking a rigid multi-layer circuit board having a first thickness and being made of a plastic material having a glass transition temperature, comprising the steps of:

• providing a clamp having a curved surface and a deformed shape memory actuator having a transformation temperature of at least said glass transition temperature of said plastic material;
• securing said circuit board to said clamp at a selected area of said circuit board;
• placing said deformed shape memory actuator against said secured circuit board;
• heating said secured circuit board and said deformed shape memory actuator to said transformation temperature to cause said deformed shape memory actuator to return to an original pre-deformed shape and thereby bend said heated circuit board at said selected area to a bent shape;
• then cooling said bent circuit board to a rigid state thereby retaining said bent shape;
• and
• releasing and separating said cooled circuit board from said shape memory actuator.

A method for reworking a multi-layer circuit board to a bent shape to form a rigid multi-layer circuit board, said circuit board being made of a plastic material having a glass transition temperature;

• comprising the steps of:
• (a) placing an unbent circuit board in juxtaposition to a deformed shape memory actuator having a transformation temperature of at least said glass transition temperature of said plastic material to thereby form an assembly;
• (b) heating the assembly to at least the transformation temperature to cause said deformed shape memory actuator to return to an original pre-deformed shape and thereby bend the circuit board to achieve a bent multi-layer circuit board;
• (c) cooling the heated assembly to allow the bent circuit board to become rigid;
• (d) separating said pre-deformed shape memory actuator from said bent circuit board;
• and
• (e) unbending said bent circuit board.