Lithographic surface or thin layer modification
AssigneeInternational Business Machines Corporation
InventorsHans Andre Biebuyck, Bruno Michel
Life of this patent
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Abstract
A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a pattern. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.
Claims9
Method for modifying a surface of a substrate by a reaction, comprising the steps of
- applying at least one participant in said reaction to a stamp comprising a deformable material;
- bringing said stamp into conformal contact with said substrate;
- confining the reaction to a lithographic pattern;
- filling the at least one participant (44) in the reaction into depressions (453) in a surface of the stamp (45) with the deformable layer (452), said depressions forming said lithographic pattern and filled with different materials (841-843);
- and
- bringing said surface of said stamp into conformal contact with said substrate such that said surface of said stamp forms a seal around the openings of said depressions, effectively confining said reaction in accordance with said lithographic pattern.
Method for modifying a surface of a substrate by a reaction, comprising the steps of
- applying at least one participant in said reaction to a stamp comprising a deformable material, said at least one participant includes a catalyst;
- bringing said stamp into conformal contact with said substrate;
- confining the reaction to a lithographic pattern;
- filling the at least one participant (44) in the reaction into depressions (453) in a surface of the stamp (45) with the deformable layer (452), said depressions forming said lithographic pattern;
- and
- bringing said surface of said stamp into conformal contact with said substrate such that said surface of said stamp forms a seal around the openings of said depressions, effectively confining said reaction in accordance with said lithographic pattern.
Dependencies are inferred from the claim text.