Automatic reflow soldering apparatus
AssigneeEightech Tectron Co., Ltd.
InventorYatsuharu Yokota
Life of this patent
Estimating the term…
Abstract
A transport mechanism for printed circuit boards is comprised of two endless drive members, movable carriers installed between these two drive members and one pair of parallel guide rails to support the carriers while moving in a horizontal state. The drive members extend diagonally between horizontal upper and lower runs on both ends of the mechanism. The carriers are installed at fixed intervals along the length of the drive members. The carriers are also provided with a roller member on both sides of the carrier to run on the upper part of the guide rail. The guide rail is further installed diagonally along the diagonal portion of the drive members at fixed intervals in order to support the carrier horizontally while in a diagonal state of movement.
Claims11
An automatic reflow soldering apparatus for soldering electronic components onto printed circuit boards inside a heated chamber under a high temperature environment while said printed circuit boards mounted with said electronic components are transported along by means of a conveyor mechanism comprising:
- parallel drive members extending in an endless path through the apparatus, a plurality of carriers attached at fixed gaps along the length of said drive members, portions of said drive members extending diagonally from one end of the apparatus for loading unsoldered printed circuit boards onto a carrier and from the other end of the apparatus for unloading soldered circuit boards from said carrier, and diagonal guide rail sections positioned along the diagonal portions of the drive members and at a fixed spacing therefrom to horizontally support the carrier for movement along said diagonal portions.
An automatic reflow soldering apparatus for soldering electronic components onto printed circuit boards inside a heated chamber under a high temperature environment while said printed circuit boards mounted with said electronic components are transported along by means of a conveyor mechanism wherein, said conveyor mechanism is comprised of two drive members each extending through horizontal upper and lower runs in an endless loop perpendicular to the horizontal, a rectangular carrier located between said drive members and coupled for movement to the drive members on diagonally opposite corners, and a pair of parallel guide rails for each of the upper and lower runs of the drive members to support the carrier for horizontal movement, said drive members positioned to move the carrier horizontally from one end of the apparatus in a position to load the unsoldered printed circuit boards onto the carrier, to a position on the other end of the apparatus to unload the soldered printed circuit boards from the carrier, a plurality of said carriers placed at fixed gaps along the length of said drive members, and rolling members provided on both sides of each carrier to support said carriers for movement along the guide rails.
Dependencies are inferred from the claim text.