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US 5,921,855 AGranted
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
AssigneeApplied Materials, Inc.
InventorsTom Osterheld, Sen-hou Ko
Life of this patent
Estimating the term…
Abstract
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves uniformly spaced over the polishing surface of the polishing pad.
Claims15
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a polishing surface having a plurality of substantially circular grooves, the grooves having a depth of at least about 0.02 inches, a width of at least about 0.015 inches, and a pitch of at least about 0.09 inches.
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a polishing surface having a plurality of substantially circular grooves, the grooves having a depth of approximately 0.03 inches, a width of approximately 0.02 inches, and a pitch of approximately 0.12 inches.
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a polishing surface having a spiral groove having a depth of at least about 0.02 inches, a width of at least about 0.015 inches, and a pitch of at least about 0.09 inches.
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a polishing surface having a plurality of grooves separated by partitions, the grooves having a depth of at least about 0.02 inches and a width of at least about 0.015 inches and the partitions having a width of at least about 0.075 inches, wherein the ratio of the width of the grooves to the partitions is between about 0.10 and 0.25.
Dependencies are inferred from the claim text.