Method for bonding a porous medium to a substrate
AssigneePall Corporation
InventorsDavid B. Pall, Brian T. Muellers
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Abstract
A method for bonding a porous medium to the surface of a solid substrate is disclosed. The method comprises contacting a dry porous medium with a dry surface of a substrate and impregnating the porous medium with a bonding composition. The impregnated porous medium is maintained in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium. At least a portion of the bonding composition is flushed through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate. The bonding composition is then evaporated at a controlled rate from the substrate and the porous medium.
Claims28
A method for bonding a porous medium to a substrate comprising:
- contacting a porous medium with a surface of a substrate;
- impregnating the porous medium with a bonding composition which at least slightly dissolves the substrate surface without dissolving the porous medium, the bonding composition including a first chemical species which is a solvent for the substrate and a second chemical species which is a non-solvent for the substrate;
- maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition;
- flushing at least a portion of the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bonding composition containing dissolved substrate from a portion of the porous medium;
- and
- evaporating the bonding composition from the substrate and the porous medium.
A method for bonding a porous medium to a substrate comprising:
- contacting a porous medium with a surface of a substrate;
- impregnating the porous medium with a bonding composition, the bonding composition including a first chemical species which is a solvent for the substrate and a second chemical species which is a non-solvent for the substrate;
- maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition;
- passing the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bonding composition containing dissolved substrate from a portion of the porous medium;
- and
- evaporating the bonding composition from the substrate and the porous medium.
Dependencies are inferred from the claim text.