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US 5,919,070 AGranted
Vacuum microelectronic device and methodology for fabricating same
AssigneePhilips Electronics North America Corporation
InventorsBabar A. Khan, David A. Cammack, Ronald Pinker
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Abstract
A vacuum state microelectronic device comprising at least a cathode, an anode, and a grid, disposed in a cavity, and formed by the wafer bonding of two planar substrates. The technology permits multiple vacuum state microelectronic devices (vacuum tubes) to be arrayed on a single substrate in an integrated manner.
Claims9
A method of fabricating a vacuum state electronic device comprising the steps of:
- providing a first substrate;
- depositing a first electrode on the first substrate;
- providing a first intermediate layer of material atop the first electrode;
- depositing a second electrode atop the intermediate layer;
- depositing a second intermediate layer atop the second electrode;
- forming a cavity through the second intermediate layer and the first intermediate layer such that at least a portion of the first and second electrodes extend within the cavity;
- providing a second substrate;
- depositing a third electrode on the second substrate;
- positioning the first and second substrates in contact with one another so as to close the cavity formed and such that the portions of the deposited electrodes within the closed cavity are in face-to-face relation;
- and
- wafer bonding, in a vacuum, the first and second substrates together to seal the cavity.
8 more elements
Dependencies are inferred from the claim text.