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US 5,913,109 AGranted
Fixtures and methods for lead bonding and deformation
AssigneeTessera, Inc.
InventorsThomas Distefano, John W. Smith, Anthony B. Faraci
Life of this patent
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AssigneeTessera, Inc.
InventorsThomas Distefano, John W. Smith, Anthony B. Faraci
Estimating the term…
In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.
A method of mounting a sheet-like microelectronic element, comprising:
A method of bonding a plurality of bond pads disposed on a flexible, sheet-like microelectronic element to a plurality of contacts on a microelectronic component, comprising:
A method of bonding a plurality of bond pads disposed on a flexible, sheet-like microelectronic element to a plurality of contacts on a microelectronic component, comprising:
Dependencies are inferred from the claim text.