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US 5,911,897 AGranted
Temperature control for high power burn-in for integrated circuits
AssigneeMicro Control Company
InventorHarold E. Hamilton
Life of this patent
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AssigneeMicro Control Company
InventorHarold E. Hamilton
Estimating the term…
A temperature control system for high power burn-in of integrated circuit chips which includes an individual heat sink at each of the integrated circuit chips to dissipate heat generated by the integrated circuit. A heater for each chip is provided and is temperature controlled so that heat may be added by the heater as a function of the heat generated by the integrated circuit chip. A temperature sensor is provided in close thermal contact with the integrated circuit chip to sense the temperature of the integrated circuit chip. A closed loop temperature controller is used to vary the amount of current provided to the heater to maintain a desired range of temperature. Thermal contact between the temperature sensor and the integrated circuit chips is insured by utilizing a spring to urge the sensor toward the integrated circuit chip.
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base a heater supported in heat conducting relationship to the base, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater in position against the base, the base having a bore therethrough;
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a thermal control assembly including a heat conducting base, a boss in a center portion of the base plate, a heater supported in heat conducting relationship to the base on a side thereof opposite the boss for heating the integrated circuit chip, and a heat sink for a dissipating heat supported in thermal conducting relationship to the heater and holding the heater against the base, and a single temperature sensor mounted relative to the base plate and engaging a circuit chip on a board, and a compartment having an input connected to receive a temperature dependent voltage signal from the temperature sensor and having an output providing current to the heater area compared function of the difference between the temperature dependent voltage and a reference voltage at a second input of the comparator.
A system for controlling the temperature of an integrated circuit chip during a burn-in test for an integrated circuit on the chip, including a circuit chip mounted on a burn-in board, a heat conducting base plate, including a heat conducting boss in center portions thereof, a heater supported in heat conducting relationship to the base plate on a side thereof opposite the boss for heating the integrated circuit chip, a heat sink for dissipating heat supported in thermal conducting relationship to the heater and clamped to hold the heater against the base plate, a bore through the base plate and boss having a through bore, a temperature sensor housing mounted in the bore, said temperature sensor housing having a second bore therein, and a temperature sensor mounted in the second bore and extending to be held in thermal contact with the integrated circuit chip, and a controller to regulate the heat dissipated by the heater in response to signals from the single temperature sensor as a function of the differential between a voltage signal from the temperature sensor and a reference voltage.
Dependencies are inferred from the claim text.