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US 5,911,837 AGranted
Process for treatment of semiconductor wafers in a fluid
AssigneeLegacy Systems, Inc.
InventorRobert Roger Matthews
Life of this patent
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Abstract
A process for removing organic materials from semiconductor wafers and a process for chemical solvent drying of wafers. In the drying process, a wafer submerged in a bath having a lower aqueous layer and an upper organic layer is lifted from the lower aqueous layer up through the upper organic layer and removed from the bath.
Claims8
A process for removing residual water from a semiconductor wafer submerged in an aqueous rinsing bath comprising the following steps:
- a) adding to the aqueous rinsing bath a low vapor pressure, organic liquid solvent being immiscible with, and having a density less than, the aqueous rinsing bath at ambient temperature and being of low toxicity and low flammability to form
- i) a lower aqueous layer,
- ii) an upper organic liquid solvent layer, and
- iii) a phase boundary between the aqueous layer and the organic liquid solvent layer;
- b) lifting the wafer from the lower aqueous layer, up through the phase boundary, and into the upper organic liquid solvent layer;
- c) removing the wafer from the organic liquid solvent layer, leaving a thin coating of organic liquid solvent adhered to the wafer;
- d) placing the organic liquid solvent coated wafer prepared in Step c) into an atmosphere comprising ozone to degrade and oxidize the organic liquid solvent coating leaving the wafer free of residual water or organic liquid solvent.
4 more elements
Dependencies are inferred from the claim text.