Three dimensional inspection system

A method for three dimensional inspection of electronic leads from a single image, the method comprising the steps of:

• a) providing a transparent reticle having a top surface;
• b) placing a part having electronic leads for inspection on a central portion of the top surface of the transparent reticle;
• c) providing fixed optical elements for providing a side perspective of the part;
• d) providing a camera located beneath the transparent reticle to receive an image of the part and the side perspective provided by the fixed optical elements wherein the camera provides image data;
• e) providing a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view;
• and
• f) processing the image data with a computer to provide a three dimensional analysis of the part.

A method for providing three dimensional inspection of an object having electronic leads from a single image, the method comprising the steps of:

• a) waiting for an inspection signal;
• b) acquiring an image of the object including a bottom view and a side view;
• c) processing the image to find a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view, a rotation, x placement and y placement of the object;
• d) locating the electronic leads of the object in the bottom view;
• e) locating the electronic leads of the object in the side view;
• f) determining a reference point for each lead;
• g) converting pixel values to world values;
• h) converting world values to part values;
• i) converting part values to measurement values, wherein the measurement values are determined by comparing the part values to predetermined part values;
• and
• j) providing a part result based on the measurement values and predetermined tolerance values.

An apparatus for three dimensional inspection of electronic leads, the apparatus comprising:

• a) a light source;
• b) a transparent reticle having a top surface, wherein the transparent reticle receives a part having electronic leads for inspection on a central portion of the top surface;
• c) a light diffuser positioned above the transparent reticle, wherein the light diffuser receives illumination from the light source and provides diffused illumination;
• d) a fixed optical element attached to the top surface of the transparent reticle, wherein the fixed optical element is positioned to reflect a side view of the part through the transparent reticle;
• e) a camera located below the transparent reticle positioned to receive an image, including a bottom view of the part through the transparent reticle and a side view of the part from the fixed optical element, wherein the camera has an image data output representative of the bottom view and the side view;
• and
• f) a processor connected to receive the image data output, wherein the processor performs a three dimensional analysis on the image data output to inspect the electronic leads, wherein the processor has an electronic lead inspection result.