Polishing system for polishing wafer

A polishing system for polishing a wafer, comprising:

• a heating unit for heating a carrying plate on which the wafer is to be adhered;
• an adhering unit for adhering the wafer on a surface of the carrying plate using an adhesive after the carrying plate is heated by said heating unit;
• a first carrying unit for carrying the carrying plate from said heating unit to said adhering unit;
• a first cooling unit for cooling the carrying plate with the wafer adhered thereto until the carrying plate reaches reaching a temperature at or lower than a softening temperature of the adhesive;
• a second carrying unit for carrying the carrying plate, with the wafer adhered thereto, from said adhering unit to said first cooling unit;
• a second cooling unit for cooling the carrying plate, with the wafer adhered thereto, until the carrying plate reaches room temperature;
• a third carrying unit for carrying the carrying plate, with the wafer adhered thereto, from said first cooling unit to said second cooling unit after the carrying plate is cooled to the softening temperature by the first cooling unit;
• a polishing unit having a polishing plate, said polishing unit disposing the wafer, adhered to the carrying plate, into contact with the polishing plate and effecting relative movement of the carrying plate with respect to the polishing plate to polish a surface of the wafer;
• a fourth carrying unit for carrying the carrying plate, with the wafer adhered thereto, from said second cooling unit to said polishing unit after the wafer is cooled to room temperature;
• a dismounting unit for removing the wafer from the carrying plate after the wafer is polished by the polishing unit;
• a fifth carrying unit for carrying the carrying plate, with the wafer adhered thereto, from said polishing unit to said dismounting unit;
• a first cleaning unit for cleaning the carrying plate, from which the wafer is removed by said dismounting unit, so as to remove the adhesive on the carrying plate;
• a sixth carrying unit for carrying the carrying plate from said dismounting unit to said first cleaning unit;
• a second cleaning unit having a wash tub, said second cleaning unit further cleaning the carrying plate by sinking in the wash tub after the carrying plate is cleaned by the first cleaning unit;
• a seventh carrying unit for carrying the carrying plate from said first cleaning unit to said second cleaning unit;
• an eighth carrying unit for carrying the carrying plate from said second cleaning unit to said heating unit after the carrying plate is cleaned by the second cleaning unit;
• the heating unit, the adhering unit, the first carrying unit, the first cooling unit, the second carrying unit, the second cooling unit, the third carrying unit, the polishing unit, the fourth carrying unit, the dismounting unit, the fifth carrying unit, the first cleaning unit, the sixth carrying unit, the second cleaning unit, the seventh carrying unit, and the eighth carrying unit being arranged and connected to form a loop line, so that the carrying plate is circulated on in said loop line for polishing a plurality of the wafer:
• the carrying plate having carrying plate data recorded thereon;
• an identifying unit for reading said carrying plate data on the carrying plate and determining whether said carrying plate data corresponds to a predetermined carrying plate data;
• a first conveying unit, responsive to the identifying unit, for discharging the carrying plate from said loop line when said identifying unit judges that the carrying plate data on the carrying plate does not correspond to said predetermined carrying plate data;
• and
• a second conveying unit for feeding another carrying plate to said loop line.

A polishing system for polishing wafers, comprising:

• a polishing apparatus that polishes the wafers by executing a cycle wherein the wafers are mounted on carrying plates, polished while mounted on the carrying plates and then dismounted from the carrying plates and the cycle is repeated using new wafers that are then mounted on the carrying plates;
• and
• the carrying plates having carrying plate data recorded thereon;
• an identifying unit for reading said carrying plate data on the carrying plates and determining whether said carrying plate data corresponds to a predetermined carrying plate data;
• a conveying mechanism, responsive to the identifying unit, for discharging ones of the carrying plates from said polishing apparatus when said identifying unit determines that the carrying plate data on the ones the carrying plates does not correspond to said predetermined carrying plate data, and for feeding other carrying plates to the polishing apparatus for use a next execution of the cycle.