Polishing apparatus having interlock function
AssigneeEbara Corporation
InventorKatsuhide Watanabe
Life of this patent
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AssigneeEbara Corporation
InventorKatsuhide Watanabe
Estimating the term…
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an interlock function includes a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators. The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of the abnormality performs a predetermined operation.
A polishing apparatus for polishing a surface of a workpiece and having an interlock function, said apparatus comprising:
A polishing apparatus for polishing a surface of a workpiece and having an interlock function, said apparatus comprising:
A method of polishing a surface of a workpiece, said method comprising:
A method as claimed in claim 30, wherein said causing further comprises operating said second motor to stop rotation of said top ring.
A method of polishing a surface of a workpiece, said method comprising:
Dependencies are inferred from the claim text.