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US 5,903,432 AGranted
Computer package with a polygonal shaped motherboard
AssigneeIntel Corportation
InventorJohn Francis McMahon
Life of this patent
Estimating the term…
Abstract
An electronic assembly that includes a plurality of electronic substrates that are plugged into a polygonal shaped motherboard. The polygonal shape of the motherboard minimizes the electrical path between electronic substrates while providing enough space between adjacent substrates to allow a fluid to sufficiently remove heat generated by integrated circuits of the substrates.
Claims8
An electronic assembly, comprising:
- a polygonal shaped motherboard which has an external surface and an internal surface located within a center opening, said internal surface having a surface pad
- a connector that is located within said center opening and which has a spring load contact that engages said surface pad of said polygonal shaped motherboard;
- and,
- an electronic substrate that is coupled to said external surface of said polygonal shaped motherboard.
1 more element
Dependencies are inferred from the claim text.