Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
AssigneeNaganoken and Shinko Electric Industries Co., Ltd.
InventorsSusumu Arai, Tohru Watanabe, Mitsutoshi Higashi
Life of this patent
Estimating the term…
Abstract
A tin-silver alloy plating solution having a tin compound, a silver compound, and a complexing agent including a pyrophosphoric compound and an iodic compound. The tin-silver alloy layer composition can achieve a high electric current efficiency without using harmful compounds such as cyanides. The plating solution is very stable, possesses adhesivability, and the solder-wettability of the tin-silver alloy layer is satisfactory. Also, the alloy is an advantageous alloy for solder plating.
Claims17
A tin-silver alloy plating solution used in the electrodeposition of a tin-silver alloy in an article with a high current efficiency and without using a cyanide material, said plating solution comprising a tin compound, a silver compound, and a complexing agent, said complexing agent including a pyrophosphoric compound and an iodic compound.
A method of electrolytic plating which comprises electrodepositing a tin-silver alloy on an article from a that plating solution containing a tin compound, a silver compound, and a complexing agent containing a pyrophosphoric compound and an iodic compound.
A method of electrolytic plating, which comprises:
- forming a resin layer on a surface of an article;
- transforming the resin layer into a selected pattern as a plating mask;
- and
- electrolytically plating the surface of the article in a plating solution containing a tin compound, a silver compound, and a complexing agent including a pyrophosphoric compound and an iodic compound.
Dependencies are inferred from the claim text.