Stacked leads-over chip multi-chip module
OwnerSalman Akraminventor
Life of this patent
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Abstract
A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice attached to the top surface of the PCB may be attached by conventional wire bonding, TAB or flip chip methods whereas those semiconductor dice attached to the bottom surface of the PCB are wire bonded or TAB connected to the top surface through openings in the PCB. The openings provide a lead-over-chip (LOC) arrangement for those semiconductor dice attached to the bottom surface resulting in shortened wire bonds. The bottom surface of the PCB may be provided with die recesses into which the openings extend, to receive the dice and bring their active surfaces even closer to the top surface of the PCB for wire bonding.
Claims17
A method of manufacturing a multi-chip module, comprising:
- providing a substrate having a top surface and a bottom surface, at least one opening therethrough, and a plurality of conductive areas on said top surface;
- attaching at least one semiconductor die having a plurality of bond pads on an active surface thereof adjacent said bottom surface of said substrate such that said bond pads are exposed through said at least one opening;
- connecting at least one of said bond pads to at least one of said conductive areas with an intermediate conductive element;
- attaching at least one semiconductor die to said top surface of said substrate;
- and
- electrically connecting said at least one semiconductor die attached to said top surface to at least another of said plurality of conductive areas.
Dependencies are inferred from the claim text.