Electrodeposited copper foil for printed wiring board and method for manufacturing the same
AssigneeMitsui Mining & Smleting Co., Ltd.
InventorsHideyasu Tagusari, Yutaka Hirasawa, Kazuhide Oshima
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Abstract
An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.
Claims5
A method for manufacturing an electrodeposited copper foil having a matte side and/a shiny side for use in making a printed wiring board, which comprises the steps of
- buffing the surface of the matte side of the electrodeposited copper foil to completely remove the original profile of the matte side;
- further buffing the surface of the matte side to form a fine roughness having buffed linear streaks and to control the surface roughness Rz of the matte side to 1.5 .mu.m or less, and
- subjecting said buffed matte side to a nodule forming treatment and controlling the surface roughness to Rz 1.5 to 2.0 .mu.m after said nodule forming treatment.
Dependencies are inferred from the claim text.