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US 5,897,743 AGranted
Jig for peeling a bonded wafer
AssigneeKomatsu Electronic Metals Co., Ltd.
InventorsKazuaki Fujimoto, Hiroshi Furukawa, Hirotaka Kato
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AssigneeKomatsu Electronic Metals Co., Ltd.
InventorsKazuaki Fujimoto, Hiroshi Furukawa, Hirotaka Kato
Estimating the term…
A peeling jig is provided for peeling a bonded wafer having voids formed in bonding surfaces so as to rebond, which does not injure the bonding surfaces or cause the adherence of particles thereto. The peeling jig includes a wedge portion 1a for inserting into the bonding surfaces, and a flat portion provided at the both sides of the base of the wedge portion. The apex angle of the wedge portion, when the chamfered angles at the bonding sides of the supporting substrate and active wafer of the bonded wafer to be separated are respectively .alpha. and .beta., is .theta. and .theta.>.alpha.+.beta.. When the wedge portion is inserted into the bonding surfaces, the right and left inclined surfaces of the wedge portion are in contact with the peripheries of the chamfered portions, and then chamfered portions are flared. Accordingly, the bonded wafer is separated by the wedge portion into the supporting substrate and the active wafer without being contacted with the bonding surfaces until the flat portions are in contact with the periphery of the bonded wafer.
A peeling jig adapted for separating a bonded wafer into two wafers after the two wafers have been bonded together in a bonding process, in order to prepare the two wafers to be bonded again, the two wafers respectively having a mirror-polished surfaced and a flat peripheral edge arranged at a chamfered angle, the peeling jig comprising:
A peeling jig adapted for separating a bonded wafer into two wafers after the two wafers have been bonded together in a bonding process, the two wafers respectively having a peripheral edge with a chamfered angle, the peeling jig being made of a material that does not damage the wafer surface and comprising:
A peeling jig for separating a bonded wafer into two wafers after the two wafers have been bonded together in a bonding process, the two wafers respectively having a peripheral edge with a chamfered angle, the peeling jig being made of a material selected from the group consisting of vinyl chloride resins and PEEK materials and comprising:
A peeling jig adapted for separating a bonded wafer into two wafers after the two wafers have been bonded together in a bonding process, the two wafers having a bonded surface and a respective peripheral edge with a flat chamfered portion adjacent the bonded surface and arranged at an angle relative to the bonded surface, the peeling jig comprising:
Dependencies are inferred from the claim text.