Integrated pull tester with an ultrasonic wire bonder
AssigneeOrthodyne Electronics Corporation
InventorGregg S. Kelly
Life of this patent
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Abstract
An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.
Claims24
A method for forming and testing a bond by an ultrasonic wire bonding tool comprising:
- placing a wire that is to be bonded into overlying relationship to a substrate that it is to be bonded to;
- placing a bonding tool in contacting relationship with said wire;
- ultrasonically driving said bonding tool sufficiently to create a bond;
- and,
- pulling said wire with a drag force applied by a rotational brake to which said wire is in contact with substantially in the direction of the longitudinal axis of said wire sufficiently to determine the strength of said bond.
An ultrasonic wire bonding method and method for testing the bond comprising:
- providing a bonding tool adapted to be ultrasonically driven for ultrasonically bonding a wire on an underlying substrate;
- holding wire to be bonded by said bonding tool;
- rotationally supporting said wire so that wire passing over said support rotates said support;
- and,
- retarding said support after wire has been bonded with a retarding force to determine whether the bond will withstand said force.
A method of wire bonding including a wire bonding tool, and means for guiding wire to the bonding tool wherein the improvement comprises:
- applying a drag force to said wire by a rotational support to which said wire is in contact with after said wire has been bonded as the bonding head to which the bonding tool is attached is raised.
An ultrasonic wire bonding method comprising:
- providing a bonding tool;
- ultrasonically driving said bonding tool by a transducer means connected to said bonding tool;
- holding wire that is to be bonded in a fixed position in part by a rotational support;
- and,
- moving said rotational support upwardly after a bond has been formed while retarding rotation thereof to pull said wire at a pre-established force for determining the strength of the bond by an encoder.
Dependencies are inferred from the claim text.