Developing unit
AssigneeNEC Corporation
InventorTakenori Yamamura
Life of this patent
Estimating the term…
Abstract
There is provided a solution heap control panel for ladling out a surplus developing solution that has been heaped up on a wafer to have a developing solution layer of a desired thickness and for passing and flowing downwards the ladled-out developing solution while rotating the wafer, so that a developing solution layer of a constant thickness is formed on the wafer. The ladled-out developing solution is dropped into a cup outside the wafer. Therefore, it is always possible to make constant the thickness of the developing solution layer without a traveling of the developing solution to the rear surface of the wafer in a developing unit.
Claims8
A developing unit, comprising;
- a rotary chuck for holding a semiconductor substrate coated with a photo-sensitive resin;
- a developing solution nozzle for dripping a developing solution onto said photo-sensitive resin;
- a rinse solution nozzle for dripping a rinse solution onto said photo-sensitive resin;
- a solution heap control panel which has a surface separated from a peripheral section of said semiconductor substrate at a predetermined distance therebetween and disposed with an inclination to the surface of said semiconductor substrate, said solution heap control panel bringing said surface into contact with an upper edge section of the outer periphery of said developing solution that has been dripped and heaped up on said rotating semiconductor substrate, so that said solution heap controlling panel ladles out and flows backwards said developing solution.
Dependencies are inferred from the claim text.