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US 5,891,753 AGranted
Method and apparatus for packaging flip chip bare die on printed circuit boards
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
An apparatus and a method for providing a fully protective package for a flip chip with a protective shield plate and an underfill encapsulant material. The apparatus comprises a semiconductor chip electrically connected by flip chip attachment to a substrate. A shield plate is placed in contact with a back surface of the semiconductor chip. An underfill encapsulant is disposed between the semiconductor chip and the shield plate, and the substrate. A glob top encapsulant may be applied about the periphery of the upper surface of the shield plate that extends to the substrate for additional protection and/or adherence.
Claims7
A method for producing a semiconductor assembly, said method comprising the steps of:
- providing a semiconductor chip having a first surface, a second surface, and a periphery;
- providing a substrate having an upper surface;
- forming an electrical communication and attachment between portions of said first surface of said semiconductor chip and portions of said upper surface of said substrate;
- providing a shield plate having a first surface, a second surface, and a periphery, said periphery of said shield plate being larger than said periphery of said semiconductor chip;
- securing said first surface of said shield plate in contact with said second surface of said semiconductor chip, said periphery of said shield plate extending beyond said periphery of said semiconductor chip;
- and
- disposing an underfill encapsulant between said first surface said periphery of said semiconductor chip and said first surface of said shield plate extending from the periphery thereof and said upper surface of said substrate, thereby enclosing said first surface and said periphery of said semiconductor chip in said underfill encapsulant and enclosing said first surface of said shield plate from the periphery thereof;
- and
- disposing a glob top material on a portion of said second surface, a portion of said first surface, and said periphery of said shield plate, said glob top material contacting said upper surface of said substrate and said underfill encapsulant.
6 more elements
A method for producing a semiconductor assembly, said method comprising the steps of:
- providing a semiconductor chip having a first surface, a second surface, and a periphery;
- providing a substrate having an upper surface;
- forming an electrical communication and attachment between portions of said first surface of said semiconductor chip and portions of said upper surface of said substrate;
- providing a shield plate having a first surface, a second surface, and a periphery, said periphery of said shield plate being larger than said periphery of said semiconductor chip;
- securing said first surface of said shield plate in contact with said second surface of said semiconductor chip, said periphery of said shield plate extending beyond said periphery of said semiconductor chip;
- disposing an underfill encapsulant between said first surface and said periphery of said semiconductor chip and a portion of said first surface of said shield plate and said upper surface of said substrate thereby enclosing said first surface and said periphery of said semiconductor chip in said underfill encapsulant and enclosing a portion of said first surface of said shield plate;
- and
- disposing a glob top material on a portion of said second surface, a portion of said first surface, and said periphery of said shield plate, said glob top material contacting said upper surface of said substrate and said underfill encapsulant.
5 more elements
A method for producing a semiconductor assembly, said method comprising the steps of:
- providing a semiconductor chip having a first surface, a second surface, and a periphery;
- providing a substrate having an upper surface;
- forming an electrical communication and attachment between portions of said first surface of said semiconductor chip and portions of said upper surface of said substrate;
- providing a shield plate having a first surface, a second surface, and a periphery, said periphery of said shield plate being larger than the periphery of said semiconductor chip;
- securing said first surface of said shield plate in contact with said second surface of said semiconductor chip, said periphery of said shield plate extending beyond said periphery of said semiconductor chip;
- disposing an underfill encapsulant between said first surface of said semiconductor chip and a portion of said first surface of said shield plate, and a portion of said upper surface of said substrate;
- disposing a glob top material on a portion of said second surface, a portion of said first surface, and said periphery of said shield plate, said glob top material contacting said upper surface of said substrate and said underfill encapsulant;
- extending said glob top material to contact a portion of the upper surface of said substrate thereby surrounding and enclosing said semiconductor chip in said glob top material.
5 more elements
A method for producing a semiconductor assembly, said method comprising the steps of:
- forming a semiconductor chip having a first surface, a second surface, and a periphery;
- forming a substrate having an upper surface;
- forming an electrical communication and attachment between portions of said first surface of said semiconductor chip and portions of said upper surface of said substrate;
- forming a shield plate having a first surface, a second surface, and a periphery, said periphery of said shield plate being larger than the periphery of said semiconductor chip;
- attaching said first surface of said shield plate in contact with said second surface of said semiconductor chip, said periphery of said shield plate extending beyond said periphery of said semiconductor chip;
- disposing an underfill encapsulant between said first surface of said semiconductor chip and a portion of said first surface of said shield plate and a portion of said upper surface of said substrate;
- disposing a glob top material on a portion of said second surface and said periphery of said shield plate;
- and
- extending said glob top material to contact said upper surface of said substrate extending over a portion thereof and contacting a portion of said underfill encapsulant.
6 more elements
Dependencies are inferred from the claim text.