Method of operating a molding machine with release film
AssigneeApic Yamada Corporation
InventorFumio Miyajima
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Abstract
An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.
Claims20
A method of forming a semiconductor device by resin molding, said method comprising the steps of:
- providing an insert member to be molded upon, a release film, a first die with a first clamping face and a first molding cavity for accepting resin, and a second die with a second clamping face;
- providing at least one first opening in the first clamping face and at least one second opening in the first molding cavity,
- providing an air sucking mechanism, and a plurality of air paths connecting the air sucking mechanism to the at least one first opening and the at least one second opening;
- operating the air sucking mechanism;
- communicating the air sucking mechanism to the at least one first opening to vacuum the release film against the first clamping face;
- subsequently, communicating the air sucking mechanism to the at least one second opening to vacuum the release film into the first molding cavity;
- clamping the insert member to be molded upon between the first clamping face and the second clamping face;
- delivering fluidized resin into the first molding cavity;
- and
- molding upon a portion of the insert member adjacent to the first molding cavity to form the semiconductor device.
The method according to claim 11, further comprising the step of heating the second die to a second predetermined temperature, different than the first predetermined temperature, prior to said step of delivering the fluidized resin.
A method of forming a semiconductor device by resin molding, said method comprising the steps of:
- providing a first die having a first clamping face and a first molding cavity;
- a second die having a second clamping face and a second molding cavity;
- a pot;
- a resin path connecting the pot to the first and second molding cavities;
- an insert member to be molded upon;
- a first release film;
- a second release film;
- an air sucking mechanism;
- a first plurality of openings formed in the first and second clamping faces;
- a second plurality of openings formed in the first and second molding cavities;
- and air sucking paths extending from the air sucking mechanism to the first and second pluralities of openings;
- dispensing the first release film onto the first die and dispensing the second release film onto the second die;
- operating the air sucking mechanism;
- communicating the air sucking mechanism to the first plurality of openings to vacuum the first and second release films against the first and second clamping faces, respectively;
- subsequently, communicating the air sucking mechanism to the second plurality of openings to vacuum the first and second release films into the first and second molding cavities, respectively;
- clamping the insert member to be molded upon between the first clamping face and the second clamping face;
- delivering fluidized resin from the pot, via the resin path, into the first and second molding cavities;
- and
- molding upon portions of the insert member adjacent to the first and second molding cavities to form the semiconductor device.
Dependencies are inferred from the claim text.