Structure for bonding semiconductor device to substrate

A structure for bonding a semiconductor device to a substrate comprising:

• a first bump provided on a first electrode of a semiconductor device;
• an arrangement of a plurality of second electrodes which are arranged on a substrate at a predetermined interval and each of which has a rectangular shape, the length of a first side in the direction of the arrangement at the predetermined interval is smaller than the length of a second side;
• and
• a second bump provided on the second electrode, said second bump being melted to join with the first bump.

A structure for bonding a semiconductor device to a substrate comprising:

• an electrode formed on a semiconductor device;
• a first bump including a first metal formed on said electrode;
• a plurality of substrate pads which are arranged on a substrate at predetermined pitches and the length of a first side thereof in parallel to an array direction is smaller than the length of a second side thereof which is orthogonal to the first side, the length of said first side is equal to or smaller than the diameter of the first bump, and the length of said second side is larger than the diameter of said first bump;
• and
• a second bump including a second metal which is different from said first metal, said second bump being formed on said substrate pad and melted to cover said first bump, the width thereof in the direction parallel to said first side being smaller than the diameter of said first bump and the width thereof in the direction parallel to said second side being larger than the diameter of said first bump.