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AssigneeFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
InventorsVolker Krause, Konrad Wissenbach, Eckhard Beyer, Hans-Georg Treusch, Gilbert Vitr
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A device for plating two or more metal plates, strips, etc., by the absoron of laser energy. The device is fitted with beam-forming optics which form the laser radiation into a beam with a rectangular cross-section. The radiation source is a laser-diode array in which several laser diodes are disposed next to each other in the same plane to give bars which can be laid next to each other, as well as stacked one on top of each other, in any numbers. In order to homogenize the laser radiation produced by the array to give a rectangular cross-section, the device proposed is fitted with special optics such as a prism which converges in the shape of a wedge, a glass plate, with a rectangular cross-section, reflective boundary drives, etc. The rectangular cross-section beam heats the two surfaces of the metal plates being plated only locally, over limited areas and to small depths, to the plastic state. In addition, sensors and control devices for control of the power of the laser-diode array and/or for changing the speed of advance of the metal plates being plated may be used.
Device for bonding at least two metal plates by absorption of laser radiation shaped into a beam with a rectangular beam cross section, said beam being directed perpendicularly to a joint, and with the metal plates to be bonded being pressed together directly at the joint by at least two rollers, wherein said beam is formed by a plurality of laser diodes arranged in rows side by side in an x-y plane to form laser diode bars, wherein said laser diode bars are arranged in a y direction of said x-y plane for a total length that is defined by an individual application, and said laser diode bars are stacked above one another in a z direction perpendicular to said x-y plane, forming a complete laser diode system, wherein said laser radiation emerging in said x-y plane of each of said laser diode bars is conducted for collimation by cylindrical microlenses arranged perpendicularly to an active radiating layer of said laser diodes, wherein one of said cylindrical microlenses is provided for all of said laser diode bars arranged in rows side by side in said x-y plane, said cylindrical microlenses being in bar form and made integral or segmented, and wherein a length of the cylindrical microlenses in the y direction corresponds to the total length of said laser diode bars in the y direction, wherein said cylindrical microlenses are followed by at least one prism tapering wedgewise, said at least one prism being arranged parallel side by side in segments and in the direction of said joint of said metal plates to be bonded, wherein an entrance aperture, an exit aperture, and a length of said at least one prism are made so that the laser radiation passing through is reflected totally in said at least one prism, and wherein heat passes through said metal plates such that said laser radiation, due to said rectangular beam cross section, causes only locally limited zones with a limited depth to enter a plastic state at two surfaces of said metal plates to be bonded.
Device for bonding at least two metal plates by absorption of laser radiation shaped to form a beam with a rectangular beam cross section that is directed perpendicularly to a joint, and the metal plates to be bonded are pressed together directly at the joint by at least two rollers, wherein said beam is formed by a plurality of laser diodes arranged in rows side by side in an x-y plane to form laser diode bars, wherein said laser diode bars are arranged in a y direction of said x-y plane for a total length that is defined by an individual application, and said laser diode bars are stacked one above another in a z direction perpendicular to said x-y plane, forming a complete laser diode system, wherein said laser radiation emerging from said complete laser diode system is supplied directly to a glass plate extending longitudinally in said x-y plane, said glass plate having a rectangular cross section and having four longitudinal sides extending in an x direction of the x-y plane, said four longitudinal sides being mirrored such that total reflection takes place in the glass plate between entrance and exit apertures of the laser radiation passing through, wherein heat passes through said metal plates such that said rectangular beam cross section of said laser radiation converts into a plastic state only locally limited zones with a limited depth on two surfaces of said metal plates to be bonded.
Method for bonding at least two metal plates by absorbing laser radiation, with the laser radiation being converted by beam-forming optical means into a beam with a rectangular cross section, said beam being aligned perpendicularly to a joint line, and the metal plates to be bonded are pressed together in a heating zone directly at the joint line by two rollers of a rolling device, wherein the laser radiation is produced by a laser diode and passes through means for homogenizing the power density distribution and wherein when the laser radiation is treated in this fashion, only locally limited zones of limited depth on two surfaces of the metal plates to be bonded are heated to a plastic state.
Device for bonding at least two metal plates by absorption of laser radiation shaped to form a beam with a rectangular beam cross section, said beam being directed perpendicularly to a joint, and the metal plates to be bonded being pressed together directly at the joint by at least two rollers, wherein said beam is formed by a plurality of laser diodes arranged side by side in an x-y plane to form laser diode bars, wherein said laser diode bars are arranged in a y direction of said x-y plane for a total length that is defined by an individual application, said laser diode bars being stacked one above another in a z direction perpendicular to said x-y plane, thus forming a complete laser diode system, wherein said laser radiation formed on each x-y plane with said laser diode bars is conducted for collimation through cylindrical microlenses mounted perpendicularly to an active radiating layer of said laser diodes, wherein one of said cylindrical microlenses in bar form is provided for all of the laser diode bars located side by side in said x-y plane, and wherein length of the cylindrical microlenses in the y direction corresponds to the total length in the y direction of the laser diode bars in said x-y plane, wherein a further cylindrical lens made in bar form extends over the entire length or height in the y and z directions of the laser diode bars to form said rectangular cross section of laser radiation, wherein heat passes through said metal plates such that the laser radiation, due to said rectangular beam cross section, causes only locally limited zones with a limited depth, located on two surfaces of said metal plates to be bonded, to enter a plastic state, and wherein a limiting device that reflects laser radiation extends for a distance lengthwise in an x direction of the x-y plane of the complete laser diode system between the complete laser diode system and the rectangular beam cross section on both narrow sides.
Device for bonding at least two metal plates by absorption of laser radiation shaped into a beam with a rectangular beam cross section that is directed perpendicularly to a joint, and with the metal plates to be bonded being pressed together directly at the joint by at least two rollers, wherein said beam is formed by a plurality of laser diodes arranged side by side in an x-y plane to form laser diode bars, wherein said laser diode bars are arranged in a y direction of said x-y plane that is defined by the individual case, said laser diode bars being stacked one above another in a z direction perpendicular to said x-y plane, thus forming a complete laser diode system, wherein the laser radiation coming from said complete laser diode system is supplied directly to at least one light guide fiber bundle, wherein a first of said at least one light guide fiber bundle is made in the form of a linear fiber bundle with light guides lying parallel side by side, wherein the light guides of the first light guide fiber bundle, at an end facing the metal plates to be bonded, are rigidly connected together shortly before emerging toward a cylindrical lens, and that means for generating high-frequency mechanical oscillations of said end are provided at said end of the first light guide fiber bundle, and wherein heat passes through said metal plates such that the laser radiation with the rectangular beam cross section causes only locally limited zones of a limited depth on two surfaces of metal plates to be bonded, to enter a plastic state.
Dependencies are inferred from the claim text.