Polishing apparatus
AssigneeEbara Corporation
InventorsMiki Shibata, Toyomi Nishi, Hidetaka Nakao, Tetsuji Togawa
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AssigneeEbara Corporation
InventorsMiki Shibata, Toyomi Nishi, Hidetaka Nakao, Tetsuji Togawa
Estimating the term…
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
An apparatus for polishing a surface of a workpiece, said apparatus comprising:
An apparatus for polishing a surface of a workpiece, said apparatus comprising:
A method of operating a polishing apparatus for polishing a surface of a workpiece, wherein said polishing apparatus comprises a polishing section for polishing the surface of the workpiece while using a liquid supplied to said polishing section from exterior thereof, a cleaning section for cleaning the thus polished workpiece while using a cleaning liquid supplied to said cleaning section from exterior thereof, an abrasive liquid supply device for supplying abrasive liquid to a polishing surface in said polishing section, said abrasive liquid supply device being supplied with liquid from exterior thereof, a temperature adjusting device for adjusting temperature of liquid supplied to at least one of said polishing section, said cleaning section and said abrasive liquid supply device, said temperature adjusting device being supplied with liquid from exterior thereof, each of said polishing section, said cleaning section, said abrasive liquid supply device and said temperature adjusting device having therein a respective liquid leakage sensor for detecting therein an occurrence of a liquid leakage, and a liquid supply stop device for stopping supply of liquid to said polishing section, said cleaning section, said abrasive liquid supply device and said temperature adjusting device, said method comprising:
Dependencies are inferred from the claim text.