Method and apparatus for inspection and correction of wiring of electronic circuit and for manufacture thereof

An electronic circuit substrate comprising:

• a substrate;
• and
• a wiring provided in a layer on the substrate and having initially a wiring disconnected portion therein which is corrected by reconnection thereof with a conductive film provided at least in the layer of the wiring;
• wherein the conductive film has end parts proximate to disconnected end portions of the wiring disconnected portion having a thickness larger than a thickness of a middle part of the conductive film provided between the disconnected end portions of the wiring disconnected portion.

A TFT substrate comprising:

• a glass substrate;
• a gate wiring formed on the glass substrate;
• an insulating film formed on the glass substrate and covering the gate wiring;
• a plurality of picture element electrodes formed on the insulating film;
• a drain or data wiring formed on the insulating film;
• a source electrode connected to the plurality of picture element electrodes and connected to the drain or data wiring through a semiconductor film;
• a protection film formed on the plurality of picture element electrodes and the upper wiring;
• wherein said drain or data wiring has initially at least one disconnected or partially disconnected portion therein which is connected by a metal thin film.