Injection molding equipment for encapsulating semiconductor die and the like

An injection molding device for encapsulating a plurality of semiconductor die, comprising:

• a form having first and second halves such that as said first half contacts said second half said first and second halves form a plurality of cavities therein, said first and second halves forming a conduit therein for receiving a heated liquid;
• a runner block having a separate runner therein for each said cavity, said runner block further having a conduit therein for receiving a heated liquid, wherein each said runner has a rectangular cross section and a width to height ratio of at least 3:1, a height of one mm or less, and a length and width wherein said length is at least ten times said width;
• a mounting plate which mates with said runner block, said mounting plate having a concave recess therein and a hole at said concave recess;
• a heated nozzle having a hole therethrough and a convex head wherein said concave recess is adapted to receive said convex head wherein said convex portion of said nozzle has a thermal conductivity less than a thermal conductivity of said mounting plate;
• a temperature plate which receives said nozzle and comprises conduits which receive a liquid for heating said temperature plate, said temperature plate heating said nozzle thereby;
• wherein said hole in said mounting plate aligns with said hole in said nozzle such that an encapsulation material can pass between said nozzle and said hole in said mounting plate;
• a spring for urging said nozzle away from said mounting plate;
• and
• a ramming tool or plunger adapted to remove interlaced material from said hole in said nozzle.