Attachment apparatus for an implantable medical device employing ultrasonic energy

An implantable medical device comprising a hermatically sealed enclosure, a header module formed of a thermoplastic material, and a mechanism for attaching the hermetically sealed enclosure to the header module, the mechanism comprising:

• a plurality of upstanding attachment tabs, each tab having a lower portion connected to a predetermined location disposed on a first mating surface of the enclosure, free ends of the upstanding attachment tabs extending in corresponding predetermined directions away from the first mating surface;
• a plurality of tab channels disposed in the header module extending away from a second mating surface of the header module, the channels being shaped and positioned to receive corresponding ones of the plurality of upstanding attachment tabs therein wherein at least portions of the first and second mating surfaces engage and are aligned respecting one another;
• a plurality of recesses, wherein at least one recess is formed in each of the plurality of upstanding attachment tabs, and header module solidified thermoplastic material filling each of the tab recesses, wherein the solidified thermoplastic material originates form melted portions of the header module disposed propinquant to its corresponding tab channel.