Method for marking or cutting a material along predetermined paths
AssigneeLectra Systemes
InventorPhilippe Bousquet
Life of this patent
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AssigneeLectra Systemes
InventorPhilippe Bousquet
Estimating the term…
Each path (P.sub.1 -P.sub.10) is travelled by moving a tool in two directions in a determined working zone (20) through which the material (22) is advanced intermittently under the action of a control circuit that is separate from the control circuit of the tool, without the work of the tool being totally interrupted while the material is advancing. Each time the material advances, it does so over a distance that is less than the length of the working zone, as measured in the advance direction of the material, and while the material is advancing, the tool is caused to travel along at least a portion of one or more paths (P.sub.6 -P.sub.8) over a portion of the material that is already within the working zone prior to the advance, and that is not removed from the working zone during the advance.
A method for plotting or cutting along predetermined paths on material with a tool wherein the tool is displaced by a first control circuit in two directions within a predetermined working zone through which the material is intermittently advanced by a second control circuit from an upstream end of the working zone to a downstream end of the working zone, wherein a working window comprises a length in the direction of the advance of the material, which length is less than the length of the working zone, and wherein the method comprises the steps of:
A plotting or cutting apparatus for plotting or cutting along predetermined paths on material with a tool wherein the apparatus comprises:
Dependencies are inferred from the claim text.