Electronic component and method for fabricating the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsIwao Ueno, Yasuo Wakahata
Life of this patent
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Abstract
The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer formed on the entire surface of the element except for the end portion of the element, wherein the protection layer is made of a metal oxide.
Claims25
A method for fabricating an electronic component, comprising the steps of:
- forming an external electrode on an end portion of an element having an internal electrode therein where the internal electrode is exposed;
- forming a metal coat layer on the entire surface of the element except for a portion where the external electrode has been formed;
- and
- heat-treating the element with the external electrode and the metal coat layer formed thereon so as to oxidize the metal coat layer on the element and thus to form a protection layer made of a metal oxide.
A method for fabricating an electronic component, comprising the steps of:
- dipping an element having an external electrode on a portion of a surface of the element and a protection layer made of a metal oxide on the other portion of the element where the external electrode has not been formed in a solution containing a glass formation substance;
- and
- forming a glass layer by heat-treating the element removed from the solution, wherein the glass layer is formed on the surface of the protection layer.
A method for fabricating an electronic component, comprising the steps of:
- dipping an element having an external electrode on a portion of a surface of the element and a protection layer made of a metal oxide on the other portion of the element where the external electrode has not been formed in a solution containing a resin component;
- and
- hardening the resin component by heating the element removed from the solution, wherein the resin component is formed on the surface of the protection layer.
A method for fabricating an electronic component, comprising the steps of:
- dipping an element having a protection layer made of a metal oxide formed on the entire surface of the element except for an end portion and an external electrode covering the end portion and a portion of the protection layer in a solution containing a glass formation substance;
- and
- forming a glass layer by heat-treating the element removed from the solution, wherein the glass layer is formed on the surface of the protection layer.
A method for fabricating an electronic component, comprising the steps of:
- dipping an element having a protection layer made of a metal oxide formed on the entire surface of the element except for an end portion and an external electrode on the end portion and a portion of the protection layer in a solution containing a resin component;
- and
- hardening the resin component by heating the element removed from the solution,
- wherein the resin component is formed on the surface of the protection layer.
Dependencies are inferred from the claim text.