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US 5,865,891 AGranted
Planarization process using artificial gravity
AssigneeVanguard International Semiconductor Corporation
InventorKung Linliu
Life of this patent
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Abstract
The time needed to planarize the surface of an integrated circuit is reduced by causing the planarization liquid to settle in the presence of artificial gravity that supplements natural gravity. A number of different ways to achieve artificial gravity are described. These include centrifuging, magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the wafer holder.
Claims9
An apparatus for planarizing a surface of an integrated circuit wafer comprising:
- means for applying a quantity of a liquid, having a viscosity between about 10.sup.-2 and 10.sup.10 poise, to said surface;
- means for applying an artificial gravitational force in a direction normal to said surface;
- and
- means for converting the liquid to a solid.
1 more element
Dependencies are inferred from the claim text.