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US 5,862,586 AGranted
Method and apparatus for mounting components to shorten tact time
AssigneeSony Corporation
InventorAkira Kimura
Life of this patent
Estimating the term…
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AssigneeSony Corporation
InventorAkira Kimura
Estimating the term…
In a components mounting apparatus, so-called mounting tact time per a single electronic component is shortened. The components mounting apparatus in which a large number of electronic components are transported from a components supplying region where a plurality of components supplying apparatuses are arranged with the large number of electronic components stored thereinto to a components mounting region in which a board is arranged with the electronic components mounted on preselected mounting positions of the board thereon is comprised of: components gripper for individually gripping the electronic components; and a tool head on which a plurality of components gripper are mounted and which is movably provided between the components supplying region and the components mounting region. The components gripper is supported movably in the upward and downward direction with respect to the tool head, and moves up and down for gripping or releasing the electronic components when positioned to a preselected position in the tool head. The tool head is provided rotatably in the forward and reverse directions so that the tool head is rotated for selecting the components gripper and positioning the selected components gripper to a preselected position.
A components mounting method for transporting a plurality of electronic components, which are stored in a plurality of components supplying apparatuses, from a components supplying region to a components mounting region and for mounting said plurality of electronic components onto said board at predetermined mounting positions, the method comprising the steps of:
A components mounting method for transporting a plurality of electronic components, which are stored in a plurality of components supplying apparatuses, from a components supplying region to a components mounting region and for mounting said plurality of electronic components onto said board at predetermined mounting positions, the method comprising the steps of:
A components mounting method for transporting a plurality of electronic components, which are stored in a plurality of components supplying apparatuses, from a components supplying region to a components mounting region and for mounting said plurality of electronic components onto said board at predetermined mounting positions, the method comprising the steps of:
Dependencies are inferred from the claim text.