Cooling device for mounting module

A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on said mounting module is dissipated by a cooling means, comprising:

• at least one conduction means which thermally connects said circuit elements with said cooling means,
• wherein said conduction means includes a predetermined number of first conductive members placed in a respective hole formed in said conduction means, said first conductive members being movably supported by a first conductive material filled between a side surface of said first conductive members and a surface of said respective hole formed in said conduction means,
• a second conductive material is provided between said first conductive material and said circuit element, and
• a predetermined number of injection passages for filling one of said first conductive material and said second conductive material, and said first conductive material and said second conductive material are provided with said first conductive member.