Electrostrictive actuated mirror array and method for the manufacture thereof
AssigneeDaewoo Electronics Co., Ltd.
InventorJeong-Beom Ji
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AssigneeDaewoo Electronics Co., Ltd.
InventorJeong-Beom Ji
Estimating the term…
An array of M.times.N electrostrictive actuated mirrors for use in an optical projection system is prepared by using a relatively thick (100-150 .mu.m) electrostrictive ceramic wafer whose mechanical properties remain intact, which in turn facilitates the manufacturing process, comprising the steps of: (a) preparing a ceramic wafer made of an electrostrictive material, having top and bottom surfaces; (b) providing on the top surface of the ceramic wafer M vertically oriented first trenches; (c) filling the M trenches with an electrically conductive material; (d) providing N-1 horizontally oriented grooves; (e) covering the top surface, including the N-1 grooves thereon, with a layer of a dielectric material; (f) mounting the ceramic wafer on an active matrix; (g) providing a metallic layer on the bottom surface of the ceramic wafer; (h) forming a photoresistive layer on top of the metallic layer; (i) forming on the ceramic wafer N-1 horizontally oriented cuts, thereby forming an array of M.times.N actuating members; (j) forming on the ceramic wafer M vertically oriented second trenches; (h) removing the photoresistive layer; (l) placing an array of M.times.N hinges; (m) forming a mirror on each of the M.times.N hinges; and (n) making electrical connections to thereby form an array of M.times.N electrostrictive actuated mirrors.
A method for manufacturing an array of M.times.N electrostrictive actuated mirrors for use in an optical projection system, wherein M and N are integers, the method comprising the steps of:
Dependencies are inferred from the claim text.
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The present invention relates to an optical projection system; and, more particularly, to an array of electrostrictive actuated mirrors for use in the system and an improved method for manufacturing the same.
Among the various video display systems available on the art, an optical projection system is known to be capable of providing a high quality display on a large scale. In such an optical projection system, light from a lamp is uniformly illuminated onto an array of, e.g., M.times.N, actuated mirrors such that each of the mirrors is coupled with each of the actuators. The actuators may be made of an electrodisplacive material such as a piezoelectric or an electrostrictive material which deforms in response to an electric field applied thereto.
The reflected light beam from each of the mirrors is incident upon an aperture of a baffle. By applying an electrical signal to each of the actuators, the relative position of each of the mirrors to the incident light beam is altered, thereby causing a deviation in the optical path of the reflected beam from each of the mirrors. As the optical path of each of the reflected beams is varied, the amount of light reflected from each of the mirrors which passes through the aperture is changed, thereby modulating the intensity of the beam. The modulated beams through the aperture are transmitted onto a projection screen via an appropriate optical device such as a projection lens to thereby display an image thereon.
The above and other objects and features of the present invention will become apparent from the following description of preferred embodiments given in conjunction with the accompanying drawings, wherein:
FIG. 1 shows a cross sectional view of a prior art array of M.times.N electrodisplacive actuated mirrors; and
FIGS. 2A to 2G represent schematic cross-sectional views illustrating the manufacturing steps in accordance with a preferred embodiment of the present invention.
In accordance with the present invention, the process for manufacturing an array of M.times.N electrostrictive actuated mirrors, wherein M and N are integers, begins with the preparation of a ceramic wafer 50, as shown in FIG. 2A, having a thickness of 100-150 .mu.m, made of an electrostrictive material, e.g., lead magnesium niobate-lead titanate(PMN-PT) and having top and bottom surfaces, 51, 52, wherein the top and the bottom surfaces, 51, 52, are flat and parallel to each other.
As shown in FIG. 2B, there are formed on the entirety of the top surface 51 of the ceramic wafer 50 M regularly spaced, vertically oriented first trenches of a fixed dimension, e.g., 54.sub.M-i, 54.sub.M-i+1, 54.sub.M-i+1, by using, e.g., a wet etching process in conjunction with a laser beam applied thereon, wherein each of the M first trenches, e.g., 54.sub.M-1, runs parallel to each other, and is separated from each other by a barrier, e.g., 55.sub.M-1, having a top flat surface 56, and i is an integer and less than or equal to M-1. Each of the M first trenches has a width of 50-70 .mu.m and a depth of 50-100 .mu.m.
As shown in FIG. 2C, thereafter, M electrodes, e.g., 57.sub.M-i+1, 57.sub.M-1, 57.sub.M-i+1, are formed by filling each of the M first trenches, e.g., 54.sub.M-i, 54.sub.M-i+1, 54.sub.M-i+1, with an electrically conductive adhesive. Subsequently, N-1 horizontally oriented, regularly spaced and parallel grooves(not shown) are made on the top surface 51 of the ceramic wafer 50 treated in accordance with the above described steps, each of the grooves having the same depth as each of the trenches to thereby generate an array of M.times.N signal electrodes.
The reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD: the reflecting means being moved or deformed by piezoelectric means
Optical elements, systems or apparatus
Term ended 27 Sep 2014 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.