Solderless `fingerprint` RF shield
AssigneeGeneral Electric Company
InventorsSayed-Amr Ahnes El-Hamamsy, Perry Scott Frederick, Roman Ihor Dachniwskyj
Life of this patent
Estimating the term…
Loading patent…
AssigneeGeneral Electric Company
InventorsSayed-Amr Ahnes El-Hamamsy, Perry Scott Frederick, Roman Ihor Dachniwskyj
Estimating the term…
Several complete fingerprint coils are attached to a support. The support is then rolled into a cylindrical shape such that a ray connecting the centers of each of pair of coils aligns with a component of a magnetic desired to be minimized or eliminated. In order to create this alignment, the support must have a length larger than the circumference of the cylinder which it forms, thereby causing a predetermined overlap. Since the coils are complete, there is no need to solder half-turns of coils to make a complete coil as was the case in previous coils. Since there are no solder points which are typically weaker than the remaining coil, the coil assembly is more resilient and less prone to breakage, making it more reliable.
A method of constructing a substantially cylindrical coil having a circumference C comprising the steps of:
A method of constructing a substantially cylindrical coil coil having a circumference C comprising the steps of:
A substantially cylindrical coil assembly having a circumference C comprising:
A substantially cylindrical coil assembly having a circumference C comprising:
A method of constructing a coil for minimizing stray RF energy, having a circumference C comprising the steps of:
Dependencies are inferred from the claim text.