Photonic device and process for fabricating the same

Abstract

A photonic device according to the present inventions obtained by resin molding a photonic element mounted on a base using a light-transmitting resin wherein the cured hardness of the light-transmitting resin is set at a value for optimally minimizing the adhesion of dust particles on the surface of the light-transmitting resin and the generation rate of internal cracks of the light-transmitting resin for a predetermined temperature change on the basis of the correlation between the two. A process for fabricating a photonic device according to the present invention comprises resin molding a photonic element by potting a light-transmitting resin having a predetermined viscosity, and applying a predetermined heat treatment for curing the resin to a final hardness after driving out the bubbles from the inside of the light-transmitting resin and for relaxing the curing shrinkage stress.

Dependencies are inferred from the claim text.