Method and system for attaching semiconductor dice to substrates

A method for attaching semiconductor dice to substrates comprising:

• providing a bumped die comprising solder contact bumps in a first pattern;
• providing a substrate comprising raised contacts in a second pattern corresponding to the first pattern;
• heating the die to a temperature between about 100.degree. C. to 300.degree. C.;
• applying an adhesive to the substrate, said adhesive formulated to cure in from 0.25 seconds to 60 seconds;
• aligning the contact bumps with the contacts;
• placing the die in contact with the adhesive on the substrate;
• and
• curing the adhesive with heat from the die to form a cured adhesive layer between the die and substrate.

A method for attaching semiconductor dice to substrates comprising:

• providing a bumped die having contact bumps comprising solder;
• providing a substrate comprising a printed circuit board including a die mounting area having contacts thereon;
• applying an adhesive to the die mounting area, said adhesive formulated to cure in from 0.25 seconds to 60 seconds;
• heating the die to a temperature sufficient to soften the contact bumps;
• placing the die on the die mounting area to form an adhesive layer therebetween;
• and
• curing the adhesive layer with heat from the die.

A method for attaching semiconductor dice to substrates comprising:

• providing a bumped die with contact bumps;
• providing a substrate with contacts comprising an anisotropic conductive adhesive;
• applying an adhesive to the substrate, said adhesive formulated to cure in from 0.25 seconds to 60 seconds;
• heating the die;
• aligning the contacts to the contact bumps;
• placing the die on the die mounting area to form an adhesive layer and place a tension force on the die;
• curing the adhesive layer with heat from the die;
• and
• curing the anisotropic adhesive under compression from the tension force.

A method for attaching semiconductor dice to a substrate comprising:

• providing a bumped die comprising contact bumps;
• providing the substrate with contacts;
• providing an adhesive formulated to cure in from 0.25 seconds to 60 seconds;
• providing a lead-on-chip die attacher comprising an aligning mechanism for aligning the die and the substrate, a heater for heating the die, a dispensing mechanism for dispensing the adhesive, and a pressing mechanism for pressing the die against the substrate;
• dispensing the adhesive on the substrate using the dispensing mechanism;
• heating the die using the heater to a temperature between about 100.degree. C. to 300.degree. C.;
• aligning the contact bumps with the contacts using the aligning mechanism;
• pressing the die against the substrate with the adhesive therebetween using the pressing mechanism;
• and
• curing the adhesive with heat from the die.

A system for attaching semiconductor dice to substrates comprising:

• an adhesive formulated to cure in from 0.25 seconds to 60 seconds;
• a substrate comprising a die mounting area and a plurality of contacts;
• a semiconductor die comprising a plurality of contact bumps;
• a heating mechanism configured to heat the die;
• a dispensing mechanism configured to dispense the adhesive on the die mounting area;
• an alignment mechanism configured to align the contact bumps on the die and the contacts on the substrate;
• and
• a pressing mechanism configured to press the die following heating thereof, against the adhesive dispensed in the die mounting area, to form a cured adhesive layer between the die and the substrate.

An electronic assembly comprising:

• a substrate comprising a plurality of contacts;
• a bumped semiconductor die comprising a plurality of contact bumps bonded to the contacts;
• and
• a cured adhesive layer formed between the die and the substrate, said cured adhesive layer comprising a material selected from the group consisting of bismaleimide and cyanoacrylate.