Column grid array or ball grid array pad on via

An electronics apparatus, comprising:

• an electronics module package including at least one protruding soldered column for mechanically supporting the electronics module package and electrically connecting to components of the electronics module package;
• a planar card having a first surface facing the electronics module package and at least one via plated with an electrically conducting material and extending at least partially through the planar card, the via including a depression extending from the first surface into the planar card, wherein at least a portion of the soldered column extends from the electronics module package into the depression of the planar card;
• and
• at least one soldered joint intermediate the depression and the soldered column and extending from above the first surface into the depressions for retaining the soldered column to the planar card and providing electrical conductivity between the electrically conducting material of the via and the solder column;
• wherein the depression has a depth and a diameter, the depth of the depression being less than the diameter of the depression, the depth of the depression being about 0.2 millimeters or less.

An electronics apparatus, comprising:

• an electronics module package including at least one column;
• a planar card having a first surface facing the electronics module package and at least one shallow depression extending from the first surface into the planar card, the shallow depression having a depth less than about 0.2 millimeters, wherein at least a portion of the column extends from the electronics module package into the depression of the planar card;
• and
• at least one solder joint intermediate the depression and the column for retaining the column to the planar card.