Anti-tamper bond wire shield for an integrated circuit

Abstract

An anti-tamper shield for an integrated circuit (IC) includes a bond wire which passes through a protective layer such as an epoxy encapsulating layer of the IC. The bond wire carries a signal, such as a steady state current, which allows an active component of the IC, such as a secure processor, to function. The bond wire is carried within and/or proximate to the encapsulating layer such that a decapsulation of the IC will cause a rupture of the electrically conductive member, thereby rendering the processor non-functional. The bond wire may be coupled to the processor in a variety of configurations, including the use of internal or external bond pads, lead frame contacts, and/or directly to a computer board on which the IC is carried. A metallic shield layer may be located between the active component and a top portion of the encapsulating layer to prevent a pirate from using an electron microscope, for example, to survey the active component region.

Dependencies are inferred from the claim text.