Inorganic seal for encapsulation of an organic layer and method for making the same
AssigneeInternational Business Machines Corporation
InventorsJohn Edward Cronin, Barbara Jean Luther
Life of this patent
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Abstract
An inorganic seal for encapsulation of an organic layer during passivation of an integrated circuit device and method for making the same is disclosed. The seal creates a structure which forms an inorganic to inorganic passivation seal over Reactive Ion Etched (RIE) edges in an all organic planar back end of the line (BEOL) insulator. The edge seal prevents the delamination of the passivation layer from the integrated circuit device or a metallization ring which may lead to subsequent formation of moisture-filled channels and corrosion of the metal lines of the device and the failure of the integrated circuit.
Claims7
An integrated circuit device comprising:
- a first layer of an inorganic insulator;
- a layer of an organic insulator deposited over said first layer;
- a second layer of an inorganic insulator deposited over said layer of organic insulator;
- and
- an inorganic insulator seal encapsulating said layer of said organic insulator between said first layer and said second layer.
An integrated circuit device comprising:
- an active chip region, including:
- a first layer of an inorganic insulator,
- a layer of an organic insulator deposited over said first layer, and
- a second layer of an inorganic insulator deposited over said organic insulator;
- a metallization ring surrounding said active chip region;
- and
- an inorganic seal for sealing said inorganic insulator layer to said metallization ring, wherein said organic insulator is encapsulated by said inorganic insulator seal.
Dependencies are inferred from the claim text.