Method and apparatus for protecting functions imbedded within an integrated circuit from reverse engineering

An integrated circuit device comprising:

• a substrate;
• a first circuit formed on the substrate wherein the first circuit performs a function;
• a second circuit formed on the substrate, the second circuit being electrically connected to the first circuit and controlling the function of the first circuit;
• and
• a molding compound encapsulating the substrate, the first circuit, and the second circuit, the molding compound having an associated capacitance, wherein the associated capacitance is used by the second circuit to control the function of the first circuit, and wherein the second circuit controls the function of the first circuit by altering the function of the first circuit in response to a change in the associated capacitance caused by removal of at least a portion of the molding compound, wherein the second circuit includes:
• a reference capacitor having a pre-selected capacitance independent of the associated capacitance of the molding compound;
• and
• a detection circuit connected to the reference capacitor, wherein the pre-selected capacitance is compared to the associated capacitance of the molding compound by the detection circuit to detect a removal of at least a portion of the molding compound and the detection circuit alters the function of the first circuit in response to the detection of a removal of the molding compounding.

An integrated circuit device comprising:

• a substrate;
• a first circuit formed on the substrate wherein the first circuit performs a function;
• a second circuit formed on the substrate, the second circuit being electrically connected to the first circuit and controlling the function of the first circuit;
• and
• a molding compound encapsulating the substrate, the first circuit, and the second circuit, the molding compound having an associated capacitance, wherein the associated capacitance is used by the second circuit to control the function of the first circuit, wherein a passivation layer is located between the molding compound and the first circuit, the second circuit, and the substrate.

An integrated circuit device comprising:

• a substrate;
• a first circuit formed on the substrate wherein the first circuit performs a function;
• a second circuit formed on the substrate, the second circuit being electrically connected to the first circuit and controlling the function of the first circuit;
• and
• a molding compound encapsulating the substrate, the first circuit, and the second circuit, the molding compound having an associated capacitance, wherein the associated capacitance is used by the second circuit to control the function of the first circuit, wherein the second circuit comprises:
• a first transistor having a source, a drain, and a gate, wherein the source is connected to a lower power supply voltage and the drain is connected to the associated capacitance;
• a second transistor having a source, a drain, and a gate, wherein the gate is connected to the drain of the first transistor, the source is connected to a lower power supply voltage, and the drain is connected to the gate of the first transistor and the first circuit, wherein a voltage at the drain controls the function of the first circuit;
• a reference capacitor connected to the drain of the second transistor;
• a first resistor having a first end connected to the drain of the first transistor and a second end connected to an upper power supply voltage;
• and
• a second resistor having a first end connected to the drain of the second transistor and a second end connected to the upper power supply voltage.

An integrated circuit system comprising:

• a first integrated circuit element, the first integrated circuit element performing a desired circuit function;
• a molding compound encompassing the first integrated circuit element, wherein a capacitance is associated with the molding compound;
• and
• a second integrated circuit element encompassed within the molding compound, wherein the second integrated circuit element is connected to the first integrated circuit element and detects a chance in capacitance resulting from a removal of at least a portion of the molding compound, and alters the desired circuit function of the first integrated circuit element in response to a detection of the removal of at least a portion of the molding compound, wherein a passivation layer lies between the molding compound and the first integrated circuit and the second integrated circuit.

An integrated circuit system comprising:

• a first integrated circuit element, the first integrated circuit element performing a desired circuit function;
• a molding compound encompassing the first integrated circuit element, wherein a capacitance is associated with the molding compound;
• a second integrated circuit element encompassed within the molding compound, wherein the second integrated circuit element is connected to the first integrated circuit element and detects a change in capacitance resulting from a removal of at least a portion of the molding compound, and alters the desired circuit function of the first integrated circuit element in response to a detection of the removal of at least a portion of the molding compound;
• and
• a third integrated circuit element and wherein the second integrated element alters the desired circuit function by enabling the third second element.

An integrated circuit system comprising:

• a first integrated circuit element, the first integrated circuit element performing a desired circuit function;
• a molding compound encompassing the first integrated circuit element, wherein a capacitance is associated with the molding compound;
• and
• a second integrated circuit element encompassed within the molding compound, wherein the second integrated circuit element is connected to the first integrated circuit element and detects a change in capacitance resulting from a removal of at least a portion of the molding compound, and alters the desired circuit function of the first integrated circuit element in response to a detection of the removal of at least a portion of the molding compound;
• and
• a third integrated circuit element and wherein the second integrated circuit element alters the desired circuit function by enabling the third integrated element and disabling the first integrated circuit element.

An integrated circuit system comprising:

• a first integrated circuit element, the first integrated circuit element performing a desired circuit function;
• a molding compound encompassing the first integrated circuit element, wherein a capacitance is associated with the molding compound;
• and
• a second integrated circuit element encompassed within the molding compound, wherein the second integrated circuit element is connected to the first integrated circuit element and detects a chance in capacitance resulting from a removal of at least a portion of the molding compound, and alters the desired circuit function of the first integrated circuit element in response to a detection of the removal of at least a portion of the molding compound, wherein the second integrated circuit element includes a capacitor, the capacitor being compared to the capacitance associated with the molding compound to detect a change in capacitance resulting from a removal of at least a portion of the molding compound.

An integrated circuit device comprising:

• an integrated circuit for performing a desired function;
• a detection circuit for detecting a change in capacitance caused by a removal of at least a portion of a molding compound and
• for altering the function of the integrated circuit in response to a detection of a change in capacitance caused by removal of at least a portion of the molding compound and
• disable means for disabling the detection circuit.

An integrated circuit device comprising:

• an integrated circuit for performing a desired function;
• a molding compound encompassing the integrated circuit;
• a capacitance associated with the molding compound;
• monitoring means for monitoring the capacitance associated with the molding compound;
• detection means for detecting a change in capacitance caused by a removal of at least a portion of the molding compound;
• and
• altering means for altering the function of the integrated circuit in response to a detection of a change in capacitance caused by removal of at least a portion of the molding compound, wherein a passivation layer lies between the molding compound and the integrated circuit.