US 5,861,231 A · Copolymers and photoresist compositions comprising copolymer resin binder component

Abstract

The present invention provides novel copolymers and photoresist compositions that contain such copolymers as a resin binder component. Preferred copolymers include three distinct repeating units: 1) units that contain acid-labile groups; 2) units that are free of both reactive and hydroxy moieties; and 3) units that contribute to aqueous developability of a photoresist containing the copolymer as a resin binder. Photoresists of the invention exhibit surprising lithographic improvements including substantially enhanced plasma etch resistance and isolated line performance as well as good dissolution rate control.

Claims5

Dependent claims

A photoresist composition comprising a photoactive component and a resin binder comprising a copolymer of the following Formula I:

##STR5## where x is about 65 to about 75 mole percent;
y is about 10 to about 20 mole percent;
and z is about 10 to about 20 mole percent.

Dependencies are inferred from the claim text.

Facts

Application

08/665,002Filed 11 Jun 1996

Granted

19 Jan 1999

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

C08F 212/24
Oxygen: phenols or alcohols
G03F 7/0045
Photosensitive materials: with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
G03F 7/039
Photosensitive materials: macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/0392
Macromolecular compounds which are photodegradable, e.g. positive electron resists: the macromolecular compound being present in a chemically…

Copolymers and photoresist compositions comprising copolymer resin binder component

Life of this patent

Copolymers and photoresist compositions comprising copolymer resin binder component

Life of this patent

Abstract

Claims5