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AssigneePark Electrochemical Corporation
InventorsEdwin J. Adlam, Sukianto Rusli, Jordan L. Wahl, Tayfun Ilercil, Robert A. Forcier, Jerome S. Sallo
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The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. Inner-layer laminates prepared according to the process of the invention are not susceptible to pink-ring formation, exhibit excellent resistance to chemical attack at drilled holes and sheared edges and are stable under thermal and mechanical stresses.
A method for promoting bond adhesion between a copper surface and a resin impregnated substrate comprising the steps of:
A method for promoting bond adhesion between a copper surface and a resinous polymeric substrate which comprises the steps of:
A method for promoting bond adhesion between a copper surface and a resin impregnated substrate comprising the steps of:
A method for promoting bond adhesion between a copper surface and a resin impregnated substrate comprising the steps of:
A method for treating a black oxide-coated copper surface comprising reducing said surface with an aqueous reducing solution containing a metabisulfite salt and a sulfide salt;
An aqueous reducing solution for treating a black oxide-coated copper surface comprising sodium metabisulfite and sodium sulfide wherein said sodium metabisulfite is present in a concentration between about 25 gm/L and about 100 gm/L and said sodium sulfide is present in a concentration between about 0.08 gm/L and about 1.0 gm/L.
Dependencies are inferred from the claim text.