Semiconductor pressure sensor module

A semiconductor pressure sensor module comprising:

• a pressure sensor unit detecting the pressure of a pressure-conveying medium;
• peripheral circuitry converting the pressure detected by said pressure sensor unit to an electrical signal and processing said electrical signal;
• a main lead frame electrically connecting said peripheral circuitry to said main lead frame;
• a subsidiary lead frame electrically connecting said pressure sensor unit to said subsidiary lead frame;
• said main lead frame electrically connected to said subsidiary lead frame;
• a solid package body constructed with a molding resin
• said solid package body including a solid portion in which said peripheral circuitry is molded together with a part of said main lead frame,
• said solid package body including a surrounding wall formed downwardly from the bottom of said solid portion to define a concave portion;
• and
• a cover member adhesively bonded to the lower end of said surrounding wall, thereby closing an aperture of said concave portion;
• said pressure sensor unit and said subsidiary lead frame fixedly arranged on the upper plane of said cover member and electrically connected with each other, and
• said cover member having a pressure introduction inlet introducing a pressure of the pressure-conveying medium into said concave portion.