Constant temperature chamber in a handler for semiconductor device testing apparatus

A constant temperature chamber for use in a semiconductor device transporting and handling apparatus for a semiconductor device testing apparatus for testing semiconductor devices, said semiconductor device transporting and handling apparatus transporting semiconductor devices to be measured to a test section where the devices undergo a test, and upon completion of the test in the test section, carrying the tested devices out of the test section, said constant temperature chamber comprising:

• a rotary stage rotatably mounted in the bottom of the constant temperature chamber enclosed by thermal insulation walls and having its central section formed with through-aperture means for passage of gases and its peripheral section without through-aperture means for passage of gases, said rotary stage being spaced apart from the bottom thermal insulation wall of said constant temperature chamber and adapted to rotate in a generally horizontal plane with semiconductor devices to be measured loaded on said peripheral section thereof with no through-aperture means;
• an axial-flow fan positioned above the central section of said rotary stage with the through-aperture means for passage of gases, said fan being rotatively driven by a drive source to create a path for circulating gases within said constant temperature chamber;
• a tubular flow-rectifying member disposed surrounding and in proximity to the outer periphery of said axial-flow fan;
• a heat source positioned above said axial-flow fan and spaced apart from the top thermal insulation wall of said constant temperature chamber, said heat source raising the temperature of the semiconductor devices to be measured loaded on said peripheral section of said rotary stare up to a preset temperature;
• and
• the central section of said rotary stage with the through-aperture means, said axial-flow fan positioned above the central section of said rotary stage, said tubular flow-rectifying member, and said heat source positioned above said axial-flow fan forming, in their cooperation, a circulating rectified gas flow in which the gases are forced to flow downwardly toward the bottom of said constant temperature chamber to pass through the central section of said rotary stage, and then flow outwardly through between the undersurface of the rotary stage and the bottom thermal insulation wall of the constant temperature chamber, and then flow upwardly along the side thermal insulation walls of the constant temperature chamber toward the top thermal insulation wall thereof, and flow inwardly along the top thermal insulation wall to said heat source, and flow downwardly through the heat source back to said axial-flow fan.