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AssigneeInternational Packaging and Assembly Corporation
InventorGerald K. Fehr
Estimating the term…
A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.
A combination heat slug for a plastic encapsulated integrated circuit (IC) package, wherein the IC package has both a metal die attach pad and leads within the package comprising:
In a polymer-encapsulated package wherein an integrated circuit (IC) die is bonded to a metal die-attach island joined by wires to metal leads extending from the polymer-encapsulated package, the package characterized in that the metal die-attach island and the die bonded thereto are wholly enclosed by polymer material and only the metal leads extend therefrom, a heat removal bridge for transferring heat from the metal die attach island to the metal leads and thence from the package, the heat removal bridge comprising a diamond substrate wholly enclosed within the polymer material and underlying, unbonded to, and proximate the die attach island and a plurality of the metal leads.
A polymer-encapsulated package comprising an integrated circuit (IC) die bonded to a metal die-attach island joined by wires to metal leads extending from the polymer-encapsulated package, the package characterized in that the metal die-attach island and the die bonded thereto are wholly enclosed by polymer material and only the metal leads extend therefrom, the package further comprising a heat removal bridge for transferring heat from the metal die attach island to the metal leads and thence from the package, the heat removal bridge comprising a diamond substrate wholly enclosed within the polymer material and underlying, unbonded to, and proximate the die attach island and a plurality of the metal leads.
Dependencies are inferred from the claim text.