Duplexer package
AssigneeFujitsu Limited
InventorsOsamu Ikata, Yoshio Satoh
Life of this patent
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Abstract
A duplexer package comprises two surface acoustic wave filter chips having different band center frequencies and a phase matching circuit for matching the phases of the two SAW filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic wave filter chips. According to the present invention, the height of the duplexer package can be lowered.
Claims11
A duplexer package comprising two surface acoustic wave filter chips having different center pass band frequencies and a phase matching circuit for matching the phases of the two surface acoustic wave filter chips, the filter chips and the phase matching circuit being accommodated in one unit,
- wherein the phase matching circuit is formed in a layer providing a cavity for the surface acoustic wave filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic filter chips.
Dependencies are inferred from the claim text.